| AX-01Density ceiling | Federal-lab guidance places traditional air-cooled racks at 1–5 kW and calls liquid necessary across the 5–80 kW range.[3] | High enough that vendors ship it as the default: the GB200 NVL72 is described as a “rack-scale, liquid-cooled design” of 72 GPUs and 36 CPUs.[4] | ASHRAE credits immersion with broad temperature support, high heat capture, and high density — but single-phase natural convection has its own ceiling, past which forced convection or two-phase is required.[1] |
| AX-02Retrofit difficulty | None. It is the incumbent, and its capital is already sunk. | Moderate. Where facility water has not been brought to the rack, ASHRAE offers liquid-to-air heat exchangers — in the rack or at the row — as an interim bridge, at the cost of rejecting that heat back into the room rather than to facility water. Rack weights, aisle pitch, and rolling-load paths still bind.[1] | Highest. Horizontal tanks break the rack-and-aisle floor plan, and the load path — rolling loads, ramps, elevators — must carry a filled tank.[1] |
| AX-03Serviceability | Pull the server, swap it, no fluid involved. This is air’s strongest axis. | Dripless quick disconnects keep the rack orientation and the service motion, but cold plates add airflow impedance and hybrid air/liquid boards keep fan power high.[1] | ASHRAE: “a crane or two-man lift is often required to remove IT equipment hardware for service.” Yet immersion may cool high-power DIMMs without the serviceability problems cold plates create on the same parts.[1] |
| AX-04Fluid handling | No working fluid at the rack. The fluid problem is displaced to the chiller plant. | Treated water or glycol in a closed technology loop. Compatible metals and water chemistry are called crucial, alongside filtration with bypass and hydronic redundancy.[3] | The whole board is wetted. ASHRAE recommends a materials-compatibility assessment and a warranty-impact evaluation before deployment;[1] OCP publishes a dedicated component immersion compatibility test guideline.[8] |
| AX-05Ecosystem maturity | Total. Every vendor, every integrator, every technician already speaks it. | Converging fast: OCP maintains vendor-neutral cold-plate requirements[6] inside a broader cooling-environments programme.[5] | Active but younger. OCP immersion requirements sit at Rev 2.10[7] with a separate 2026 compatibility guideline;[8] ASHRAE describes a field of many startup and established players.[1] |
| AX-06Heat capture fraction | By definition none to liquid — every watt leaves through the room. | Depends entirely on what the plates touch. Federal-lab practice specifies at least 95% of rack heat captured directly to liquid;[3] a CPU-only design that leaves memory on air misses that and erodes the economic case.[1] | Essentially complete by construction — the fluid touches everything on the board. |